面向三维多核片上系统的热感知硅后能耗优化方法  

Thermal-Aware Post-Silicon Energy Optimization on 3-D Multi-Core SoCs

作　　者：靳松[1] 韩银和[2] 王瑜[1] 

机构地区：[1]华北电力大学电气与电子工程学院电子与通信工程系,河北保定071001 [2]中国科学院计算技术研究所计算机体系结构国家重点实验室,北京100190

出　　处：《计算机学报》2016年第9期1763-1774,共12页Chinese Journal of Computers

基　　金：国家自然科学基金(61204027);河北省自然科学基金(F2013502274);中央高校基本科研业务费专项资金项目(2014ZD32;13MS69)资助~~

摘　　要：高能效(Energy efficiency)已成为目前嵌入式多核片上系统(System-on-Chips,SoCs)设计中的首要优化目标.基于电压/频率岛设计的三维多核片上系统能够为构建高能效系统提供一种有力的解决方案.然而,不断增加的工艺偏差导致制造后芯片中电压/频率岛的性能参数偏离其额定值.在较大偏差的影响下,可能无法满足任务的截止时间约束.另外,已有的研究工作大多针对二维平台,无法很好地解决因三维集成而不断恶化的发热问题.面向采用电压/频率岛设计的三维多核SoC,文中提出一个硅后优化框架,在最小化系统能耗的同时,能够满足任务截止时间和系统热约束.除了能效感知的任务调度和电压/频率分派方法,提出的优化框架还采用任务迁移平衡核栈的功耗以实现热优化.实验结果表明,与已有的热平衡方法比较,文中提出的方法能减少平均18.6%的能耗.同时,与经典的能耗优化方法比较,文中提出的方法能降低平均5.6℃的峰值温度.Energy efficiency has been become a primary design concern for embedded multi-core system-〇 n-chips （SoCs）. Three dimensional （3-D） multi-core SoC based on voltage/frequency islands （VFI） has been recognized as a promising solution for building an energy efficiency system. However, the ever-increasing process variation （PV） leads to performance parameter of the VFI deviating from the nominal values. As a result, violation of the task deadline constraint may occur at post-silicon under large variations. Moreover, the existing work commonly targeted 2_D platform, which cannot address the exacerbated thermal issues from 3-D integration. In this paper, we propose a post-silicon optimization framework targeting VFI-based 3-D multi-core SoCs to minimize system energy meanwhile still meeting task deadline and thermal constraints. Besides energy-aware task scheduling and voltage/frequency assigning, we also conduct task migrating to balance the powers across the core stacks for thermal optimization. Experimental results demon-strate that on average our framework can achieve an energy reduction of 18. 6% over the prior thermal balancing algorithm. Moreover, on average a reduction of 5. 6℃ in peak temperature is achieved by our framework, compared with the state-of-art energy optimization scheme.

关 键 词：系统能耗 三维多核片上系统 工艺偏差 电压/频率岛 任务调度 热优化 

分 类 号：TP393[自动化与计算机技术—计算机应用技术]