Cu-4Ni-2Sn-Si合金的铸态组织及均匀化退火工艺的研究  

Study on As-Cast Microstructure and the Annealing Process of Cu-4Ni-2Sn-Si Alloy

作　　者：叶艳君[1] 王智祥[1] 潘少彬[1] 金熌 陈文江[1] 

机构地区：[1]江西理工大学材料科学与工程学院,江西赣州341000

出　　处：《铸造》2016年第8期763-766,773,共5页Foundry

基　　金：国家自然科学基金项目(51161008)

摘　　要：采用OM、SEM、EDS及硬度测试等分析方法研究了Cu-4Ni-2Sn-Si合金的铸态显微组织,以及均匀化退火对合金显微组织及性能的影响。结果表明,铸态Cu-4Ni-2Sn-Si合金的显微组织枝晶发达,合金元素分布不均匀,Sn呈反偏析现象,且室温组织由α-Cu和δ-Ni2Si相组成。随着均匀化退火温度的升高及保温时间的延长,合金元素的分布趋于均匀化,Sn的反偏析现象基本被消除,有大量δ-Ni2Si析出且趋于均匀化分布,均匀化退火效果受温度影响较大。由此建议Cu-4Ni-2Sn-Si合金较佳的均匀化退火条件为850℃×4 h,其硬度值为HB99.5,电导率为16.64%IACS。The microstructure of as-cast Cu-4Ni-2Sn-Si alloy and the annealing effect on the microstructure were investigated by OM, SEM, and EDS. The results show that the significant dendrite exists in the microstructure of the as-cast Cu-4Ni-2Sn-Si alloy, Sn element exhibit inverse segregation phenomenon. And the components of as-cast alloy are α-phase and a few δ-phase. After homogenization, the distribution of alloying elements tend to homogenize, the inverse segregation phenomenon of Sn element were eliminated gradually, and an increasing number of δ-Ni2Si phase were precipitated, the precipitated phase distribution tends to be uniform as the heating temperature and holding time increasing. But the temperature influence on the homogenization is more significantly than the holding time. So the suitable homogenization process for the alloy is 850 ℃×4 h, and the hardness and the conductivity were HB99.5 and 16.64%IACS resoectivelv.

关 键 词：Cu-4Ni-2Sn-Si合金 均匀化退火 显微组织 枝晶 

分 类 号：TG146.11[一般工业技术—材料科学与工程] TG166.2[金属学及工艺—金属材料]