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作 者:王猛[1] 唐恩凌[1] 夏瑾[1] 韩雅菲[1] 张爽[1] 许名扬 张立佼 袁健飞 吴尽[1]
出 处:《真空科学与技术学报》2016年第8期910-916,共7页Chinese Journal of Vacuum Science and Technology
基 金:国家自然科学基金项目(11272218);辽宁省兵器科学与技术重点实验室开放基金项目
摘 要:为理解和评估超高速碰撞产生等离子体及其对航天器逻辑芯片的电磁干扰效应,进行二级轻气炮强冲击加载实验模拟超高速撞击;利用郎缪尔三探针诊断系统对弹丸撞击2A12铝板产生等离子体的电子温度和电子密度在给定位置处进行诊断测量,建立逻辑芯片信号采集系统对给定位置处逻辑芯片遭受干扰进行监测分析。结果表明,撞击速度在2.5~3.5km/s范围时均能产生等离子体,等离子体电子温度和电子密度均随撞击速度而增加,其中电子密度与撞击速度呈指数关系。超高速碰撞产生等离子体对逻辑芯片运行状态的干扰主要表现为三种形式,分别是传输信号瞬态中断而后恢复、输出逻辑关系短暂失真和逻辑门失效。Motivated by understanding and assessing theplasma,generated byhypervelocity impact,and its interference on the air-borne logic circuit chips,a ground simulation was performed. The impact at a 2A12 Al target was simulated by 2A12 Al bullets,4. 5 mm in diameter,shot from two-stage light-gas gun. The influence of the impact velocity on the characteristics of the induced plasma was investigated with Langmuir triple-probe; the plasma interference on the air-borne logic circuit chips was evaluated with a lab-built signal acquisition unit. The simulated results show that strongly depending on the impact velocity,the plasma seriously interferes with the logic circuit chips. For example,as the impact velocity increased in 2. 5 ~ 3. 5 km / s range,the electron temperature shot up rapidly and the electron density increased exponentially,dropping down in a fluctuation mode. The interference on the chips mainly included the instantaneous interruption of output signal,distortion of output logic and failure of logic gates.
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