新型铜颗粒填充的液态金属热界面材料导热性能实验研究  被引量:9

Experimental Investigation on the Thermal Performance of Liquid Metal Filled with Copper Particles as Thermal Interface Material

在线阅读下载全文

作  者:李根[1] 纪玉龙[1] 孙玉清[1] 马鸿斌[1] 邢丰[2] 刘艳年 

机构地区:[1]大连海事大学轮机工程学院,辽宁大连116026 [2]中海油田服务股份有限公司,河北三河065201

出  处:《西安交通大学学报》2016年第9期61-65,73,共6页Journal of Xi'an Jiaotong University

基  金:交通运输部应用基础研究资助项目(2015329225070);国家自然科学基金资助项目(51579026);归国留学人员科技活动项目(人社厅函[2014]240号);中央高校基本科研业务费资助项目(3132016340)

摘  要:为强化界面传热,研制了一种以铜颗粒为填充材料、Ga62.5In21.5Sn16液态金属为基体的新型复合热界面材料,并对其导热性能进行了测试。首先将所制备的热界面材料放置在两片铜片之间,制备3层结构试样,然后利用激光导热仪测量所制备试样的导热性能,并计算相应试样的接触热阻。实验结果表明:铜颗粒填充型液态金属可以大大提高氧化后液态金属作为热界面材料的性能,利用铜粉质量分数分别为5%和10%的液态金属所制备的试样,导热系数和接触热阻分别为(200.33±15.66)、(233.08±18.07)W/(m·K)和(7.955±0.627)、(5.621±0.437)mm2·K/W,较利用氧化后液态金属所制备试样的导热系数分别约提高了68%和96%,接触热阻分别约降低了57%和70%,并可以有效降低液态金属的流动性,从而减少液态金属在使用过程中溢出现象的发生。In order to enhance the interface heat transfer, Ga62.5 In21.5 Sn16 liquid metal alloy (LMA) with addition of copper particles as the thermal interface material (TIM) was investigated. Samples with sandwiched structures were fabricated by inserting the LMA TIMs between two copper plates. The laser flash analysis method was applied to measure the overall thermal conductivity of these samples. The results indicated that the addition of copper particles can obviously improve the thermal performance of oxidized LMA used as TIM. The measured thermal conductivity and thermal contact resistance of oxidized LMA samples filled with copper particles (the mass fractions of the copper particles are 5% and 10%, respectively) were (200.33 ±15.66), (233.08±18.07) W/(m · K) and (7. 955±0. 627), (5.621±0.437) mm2 · K/W, respectively. Compared with the samples of oxidized LMA without copper particles, the thermal conductivity was increased by about 68% and 96%, and the thermal contact resistance was decreased by about 57% and 70%, respectively. In addition, the fluidity of LMA can also bereduced with the addition of copper particles, hence alleviating the pump out effect in its practical use.

关 键 词:液态金属 铜颗粒 热界面材料 导热系数 接触热阻 

分 类 号:TK121[动力工程及工程热物理—工程热物理]

 

参考文献:

正在载入数据...

 

二级参考文献:

正在载入数据...

 

耦合文献:

正在载入数据...

 

引证文献:

正在载入数据...

 

二级引证文献:

正在载入数据...

 

同被引文献:

正在载入数据...

 

相关期刊文献:

正在载入数据...

相关的主题
相关的作者对象
相关的机构对象