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作 者:王子建[1] 严飞[2] 侯智剑 王崇祜 徐志钮[1]
机构地区:[1]华北电力大学河北省输变电设备安全防御重点实验室,保定071003 [2]中国电力科学研究院,北京100192 [3]上海思源电力电容器有限公司,上海201108
出 处:《电工技术学报》2016年第17期207-216,共10页Transactions of China Electrotechnical Society
基 金:中央高校基本科研业务费专项资金资助项目(2015MS92)
摘 要:为了获得高压全膜电容器在热稳定性能试验条件下外壳与内部的温度分布,在Fluent 15.0中建立了电容器温度场仿真模型,并利用有限体积法进行了求解。仿真结果表明:对于电容器外壳,其小侧面温度较高,外壳最热点在小侧面,而电容器最热点则位于靠近尾部的中轴线上。由于电容器内部结构复杂,导致电容器外壳表面温度分布不均匀,并非规则的温度升高或降低的趋势,而是存在局部较热的区域。为了验证仿真模型的正确性,利用光纤光栅温度传感器及红外成像仪分别对热稳定性能试验条件下的电容器内部及外壳温度进行了实际测量,实测与仿真结果基本吻合从而验证了仿真模型的正确性。To obtain the temperature distributions on the shell and in the core of high voltage film capacitors in the thermal stability test, a thermal field model for high voltage film capacitors is formulated in Fluent 15. 0 and solved based on the finite volume method. The results reveal that the side surface is higher than other surfaces on the shell and the hottest spot on the capacitor shell is located on the side surface. The hottest spot in the entire capacitor is located on the central axis of the capacitor close to the tailpart. The temperature distributions on the capacitor shell are non- uniform. Because of complexity of capacitor structure, the temperature does not always increase/decrease monotonically. And there are several local hot spots. A fiber grating capacitor temperature monitoring system and an infrared thermal imager are used to measure the temperatures of some key points on the shell and in the interior of a high voltage film capacitor respectively in the thermal stability test. The measured results are qualitatively and quantitatively consistent with the simulated results.
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