Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints  

作　　者：赵国际 文光华 盛光敏 景彦霞 

机构地区：[1]College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China [2]Chongqing Industry Polytechnic College, Chongqing 401120, China

出　　处：《Journal of Central South University》2016年第8期1831-1838,共8页中南大学学报（英文版）

基　　金：Project(50675234)supported by the National Natural Science Foundation of China

摘　　要：Rapidly solidified Sn-9Zn-0.1Pr(/Nd) alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd(mass fraction) addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr(/Nd) alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr(/Nd) solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.Rapidly solidified Sn-9Zn-0.1Pr（/Nd） alloy foils were prepared by melt-spinning method. Through comparison, the effects of rapid solidification process and 0.1%Pr/Nd（mass fraction） addition on the microstructure, thermodynamic characteristic of Sn-9Zn solder alloy were analyzed. The tensile-shear tests were used to evaluate the mechanical properties of solder/Cu joints. The results show that the rapid solidification process can greatly refine the microstructure of Sn-9Zn-0.1Pr（/Nd） alloys. After rapid solidification, the effects of Pr/Nd addition on microstructure are depressed. The pasty range of the rapidly solidified Sn-Zn-RE solders is also reduced significantly. The mechanical properties of solder/Cu joints are obviously improved using the rapidly solidified Sn-9Zn-0.1Pr（/Nd） solder alloy, which results in the formation of uniform interface. The promotion effect of Nd addition in Sn-9Zn alloy on the interfacial reaction of solder/Cu joint is more remarkable than that of Pr.

关 键 词：rapid solidification Sn-Zn-RE solder microstructure interfacial property 

分 类 号：TG425[金属学及工艺—焊接]