金相观察中的化学浸蚀现象探讨  

Discussion on Chemical Etching Phenomenon in Metallographic Observation

作　　者：董凤奎 何健楠 刘金源 

机构地区：[1]宝钢集团广东韶关钢铁有限公司,广东韶关512123

出　　处：《江西冶金》2016年第4期13-14,F0003,共3页Jiangxi Metallurgy

摘　　要：传统观念认为化学浸蚀后晶界发暗是由于晶界较难浸蚀,晶粒发暗是由于晶粒倾斜了一定角度,但实际观察发现,晶界发暗是由于晶界处较难浸蚀和晶粒表面粗糙不平所造成。The traditional concept believes that the dark grain boundary is due to difficult to be etched. The dark grain is due to the tilt angle of grain surface. But the actual observation find that the dark grain boundary is owing to its difficult to erosion and the rough grain surface.

关 键 词：显微组织 化学浸蚀 晶粒 

分 类 号：TG115.21[金属学及工艺—物理冶金]