焊接温度对镁合金电化学性能的影响  

Effect of welding temperature on electrochemical performance of Mg alloy

作　　者：黄锐妮[1] 

机构地区：[1]中国电子科技集团公司第十八研究所,天津300384

出　　处：《电源技术》2016年第8期1620-1621,共2页Chinese Journal of Power Sources

摘　　要：采用真空扩散焊工艺对镁合金与银箔进行连接,焊后利用金相分析、恒流极化、动电位扫描研究镁合金在不同焊接温度下的显微组织和电化学性能。结果表明:随焊接温度的升高镁合金的晶粒尺寸不断长大;耐腐性能随焊接温度的升高而不断降低,焊接温度由330℃升高到395℃时,镁合金的腐蚀电流从1.58×10^(-3) A/cm^2增大到6.37×10^(-3)A/cm^2,这与合金的晶粒尺寸有关。Mg alloy and Ag were bonded by vacuum diffusion bonding. The microstructure feature and electrochemical performance of different joints were investigated by microstructure, constant current polarization and potentiodynamic scan. The results show that the grain size of Mg alloy grows gradually with the increase of welding temperature; while the corrosion resistance of Mg alloy decreases with the increase of welding temperature, and the corrosion current density increases from 1.58 ×10-3Ncm2 to 6.37 × 10-3A/cm2when welding temperature increases from 330 ℃ to 395℃. This is related to the increase of the grain size of Mg alloy.

关 键 词：镁合金 焊接温度 电化学性能 

分 类 号：TM911[电气工程—电力电子与电力传动]