纳米铜导电墨水涂覆后的烧结工艺研究  

Investigation of sintering process of nano-copper conductive ink

作　　者：刘文平[1,2,3] 秦海青[1,2,3] 雷晓旭[1,2,3] 林峰[1,2,3] 张振军[1,2,3] 卢安军[1,2,3] 

机构地区：[1]中国有色桂林矿产地质研究院有限公司,广西桂林541004 [2]国家特种矿物材料工程技术研究中心,广西桂林541004 [3]广西超硬材料重点实验室,广西桂林541004

出　　处：《粉末冶金技术》2016年第4期295-299,共5页Powder Metallurgy Technology

基　　金：桂科能(15122001-34)：渐进式自由烧结金刚石串珠的研制

摘　　要：通过高频感应等离子体蒸发凝聚法制备纳米铜粉,分散于有机载体中制备成纳米铜墨水。研究表明：制备的纳米铜粉球形度高,结晶性好,钝化处理以后表面形成含Cu2O的钝化膜。墨水成膜以后在250-400℃烧结,膜层可获得优异的导电性。烧结时间对导电性的影响不大,烧结温度越高,导电性越好。经400℃烧结,大部分纳米铜粉熔化,形成面接触导电,烧结60 min,方阻为46.2 mΩ/□。Copper nanoparticles were prepared by high-frequency induction plasma evaporation method and nano- copper ink was synthesized by dispersed copper powder in the organic carrier. The results show that copper nanoparticles appear high spherical degree and are good crystalline powder. The surface forms Cu2O passivating layer after passivating treatment. The electrical conductivity of the films is good when the films are exposed to sintering temperature in the range of 250℃ -400℃. The sintering time is a little effect on the electrical conductivity. The sheet resistance of the films decreases with the increasing of sintering temperatures. It can be reach to 46.2 mΩ/□ with 400℃ sintering for 60 min, due to the melting of major copper nanoparticles forming conductive surface contact.

关 键 词：纳米铜粉 导电墨水 柔性基材 烧结 

分 类 号：TQ174.758[化学工程—陶瓷工业]