低介电常数无氟聚酰亚胺薄膜制备方法的研究进展  

Development of Preparation Methods for Low Dielectric Constant Non-fluorinated Polyimide Film

作　　者：姬亚宁[1] 唐小青[1] 刘业强[1] 周福龙 

机构地区：[1]桂林电器科学研究院有限公司,广西桂林541004

出　　处：《绝缘材料》2016年第9期28-32,共5页Insulating Materials

摘　　要：介绍了近年来低介电常数无氟聚酰亚胺薄膜的制备方法以及进展情况,重点阐述了多孔法与化学法,分析了各种制备方法的优缺点,并指出了化学法中的侧链枝法将具有较好的应用前景。The preparation methods and progress of low dielectric constant non-fluorinated polyimide filmin recent years were reviewed, and the advantages and disadvantages of different preparation methods were analyzed.

关 键 词：低介电常数 聚酰亚胺 无氟 

分 类 号：TM215.3[一般工业技术—材料科学与工程]