含三稠环结构聚酰亚胺的研究现状  

Research Status of Polyimide Containing Three Fused Ring Structure

作　　者：何思呈 王亚辉[2] 黄杰[2] 钱心远[2] 廖波[2] 

机构地区：[1]麓山国际实验学校,湖南长沙410006 [2]株洲时代新材料科技股份有限公司,湖南株洲412007

出　　处：《广州化工》2016年第18期23-26,共4页GuangZhou Chemical Industry

摘　　要：聚酰亚胺(PI)因其突出的热性能和综合性能,近年来在柔性有机电致发光器件(FOLED)封装领域越来越受到重视。本文介绍了国内外对含三稠环结构聚酰亚胺的研究现状;其中三稠环主要包括咔唑、芴、芴酮、二苯并呋喃和二苯并噻吩;详细介绍了三稠环结构对聚酰亚胺性能的影响;重点分析了三稠环结构与聚酰亚胺的热性能、溶解性能、光电性能的关系;展望了含三稠环结构聚酰亚胺的发展。In recent years, polyimide （PI） has attracted more and more attention in the field of flexible Organic Light-Emitting Diode （FOLED） package due to its outstanding thermal performance and comprehensive performance. The research status of polyimide containing three fused ring structure at home and abroad was introduced, three fused ring mainly included carbazole and fluorene fluorenone, dibenzofuran and dibenzothiophene. The effects of three fused ring structure on the properties of polyimide were introduced in detail, the relationship between the thermal properties, the solubility and the photoelectric properties of polyimide containing three fused ring structure were mostly analyzed, the development of polyimide containing three fused ring structure was discussed.

关 键 词：三稠环 聚酰亚胺 热性能 

分 类 号：O631.2[理学—高分子化学]