用于中成药膏药载体的SIS热熔压敏胶配方研究  

Formulation study of SIS hot melt pressure sensitive adhesive as carrier of Chinese patent ointments

作　　者：佘振银[1] 李蓓蕾[1] 袁煜艳[1] 

机构地区：[1]巴陵石化公司合成橡胶事业部,湖南岳阳414014

出　　处：《粘接》2016年第10期49-52,共4页Adhesion

摘　　要：考查了多种增塑剂、增黏树脂及其用量对SIS热熔压敏胶的初粘性、持粘性、180°剥离强度和软化点的影响,并通过添加中成药的方法试验研究了膏药、贴剂用热熔压敏胶的配方,得出了m(SIS):m(环烷油):m(氢化C5石油树脂)=10:7:15的基础配方。所制备的膏药具有初粘性较好、持粘性较大、剥离力较小且加药温度较低的特点,满足了膏药、贴剂的使用要求。In this paper, the effects of type and amount of plasticizers and tackifying resins on the initial tackiness, holding power, 180° peeling strength and softening point of the SIS hot melt pressure sensitive adhesive （HMPSA） were investigated. With Chinese patent drug addition tests, we studied the HMPSA formulations for ointments and patches, and obtained the basic formulation, i.e. SIS：naphthenic oil：hydrogenated C5 petroleum resin=10：7：15, and the resulting ointments have good initial tackiness, higher holding power, lower peeling strength and lower drug addition temperature and meet the requirements for ointments and patches.

关 键 词：药膏 热熔压敏胶 性能 配方 

分 类 号：TQ436.3[化学工程]