导热银胶的特性研究  

Characteristic Research on Thermal Conductivity Silver Adhesive

作　　者：左凤娟[1] 郑静[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2016年第2期50-54,共5页Hybrid Microelectronics Technology

摘　　要：在厚膜混合集成电路中，随着开关电源电路功率和组装密度不断增加，内部功率元器件的尺寸不断向大尺寸、轻薄的方向发展，对该类器件的组装方式提出更严苛的要求。本文对一种新导热银胶的特性进行研究，选定其应用的粘接导体界面和粘接元器件界面，对其在高温贮存和高低温循环环境下的导电性能和粘接性能进行探讨，并比对与常规焊膏焊接的导热性能，为功率器件的组装工艺提供一种可实施的途径。In the field of HIC, with the increase of circuit power and assembly power density in switching power supply, the size of the internal components developes toward to large size and light thin, so more stringent requirements for the assembly of such devices are presented. In this paper, the thermal conductivity silver adhesive is studied. The applications of bonding con- ductor interface and device interface are selected. And also with the conductive properties and bonding properties of the high tem- perature storage and high temperature cycling environment are discussed. The thermal conductive performance is compared with conventional solder welding, and a feasible approach for assembly process of the power devices is provided.

关 键 词：HIC 功率器件 导热银胶 

分 类 号：TM24[一般工业技术—材料科学与工程]