高可靠氧化铍基板可焊接厚膜导体特性研究  

Characteristic Research on High Reliable Solderable Thick Film Conductor for BeO Substrate

作　　者：董永平[1] 

机构地区：[1]中国电子科技集团公司第43研究所,合肥230088

出　　处：《混合微电子技术》2016年第2期58-61,共4页Hybrid Microelectronics Technology

摘　　要：本文通过对氧化铍基片上钯银类、铂银类导体在高温储存条件下的膜层附着力性能研究，及铂银导体在不同工艺、各类应力环境下的膜层附着力性能和银离子迁移性能分析，得出了氧化铍基片上使用的可焊接厚膜导体材料与工艺要求，较好的满足了高可靠混合集成电路成膜基板的制作。This paper studied the adhesion performance of palladium silver, platinum silver conductor on BeO substrate un- der the high temperature storage condition, also studied the platinum silver conductor adhesion and silver migration performance in different processes and all kinds of environmental stress. Through these studies, the solderable thick film conductor material and process requirements are obtained. It meets the film foming substrate fabrication requirements of high reliable hybrid integrated circuit.

关 键 词：厚膜 氧化铍 膜层附着力 银离子迁移 

分 类 号：TB331[一般工业技术—材料科学与工程]