大功率LED封装基板研究进展  

Development of Packaging Substrate for High-power LED

作　　者：王文君[1] 王双喜[1] 张丹[1] 黄永俊[1] 李少杰[1] WANG Wenjun WANG Shuangxi ZHANG Dan HUANG Yongjun LI Shaojie(College of Engineering, Shantou University, Shantou 515063)

机构地区：[1]汕头大学工学院,汕头515063

出　　处：《材料导报》2016年第17期44-50,共7页Materials Reports

基　　金：广东省扬帆计划项目(2015-9);广东科技计划项目(2014B090908001)

摘　　要：随着大功率LED向高电流密度、高光通量发展,热流密度猛增使得LED散热问题日益严重。封装基板对LED的散热至关重要。在简介LED的封装结构及散热方式的基础上,分析总结了常见封装基板材料的性能参数,并对目前市场常见封装基板MCPCB、DBC、DAB、DPC、LTCC、HTCC、Al/SiC以及最近出现的新型材料基板的特征、制造工艺、应用等进行了综述。As the current density and light flux of high-power LED become higher and higher,the heat dissipation for high-power LED is becoming more and more important.The packaging substrate is a crucial channel for heat dissipation in LED lighting.In this paper,the structure of LED packaging and heat dissipation characteristics of LED are introduced briefly.The performance of some packaging substrate materials is summarized.Finally,the characteristic,manufacturing processes,applications of common substrates,such as MCPCB,DBC,DAB,DPC,LTCC,HTCC,Al/SiC,as well as the new kinds of substrate materials are reviewed respectively.

关 键 词：大功率LED 散热方式 封装基板 

分 类 号：TB34[一般工业技术—材料科学与工程]