Al表面化学镀Ni-P合金及Al/Ni-P/Cu复合材料电性能的研究  

Studies on electroless plating Ni-P alloy film on Al substrate and electrical property of Al/Ni-P/Cu composite

作　　者：陈国宏[1] 张健[2] 王若民[1] 缪春辉[1] 郑治祥[2] 汤文明[2] CHEN Guohong ZHANG Jian WANG Ruoming MIAO Chunhui ZHENG Zhixiang TANG Wenming(School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China Anhui Institute of Electric Power Science, State Grid, Hefei 230601 ,China)

机构地区：[1]国网安徽省电力公司电力科学研究院,合肥230601 [2]合肥工业大学材料科学与工程学院,合肥230009

出　　处：《功能材料》2016年第B06期7-12,共6页Journal of Functional Materials

基　　金：国家电网科技攻关资助项目(2012QTXM0751)

摘　　要：化学镀Ni-P合金中间层可提高Al材表面Cu镀覆性能。采用化学镀工艺,在Al表面沉积均匀连续的Ni-P合金层,再电镀Cu,形成Al/Ni-P/Cu复合材料。研究化学镀Ni-P合金层的表面形貌,成分及其成膜机理,以及Al/Ni-P/Cu复合材料的结构与电性能。结果表明,Al材经碱蚀前处理后,在其表面形成腐蚀坑或凸起,NiP合金在此位置优先沉积,逐渐成膜。碱性镀5min,酸性镀25min后,在Al材表面形成厚约5μm均匀致密的Ni-P合金镀层,再在其表面电镀140μm厚Cu层制备的Al/Cu复合材料的电阻率为2.92×10^(-8)Ω·m,经过150℃,360h热处理后,未发生Al、Cu相互扩散,复合材料的电阻率为3.04×10^(-8)Ω·m,结构与性能十分稳定。Electrolessplating Ni-P alloy layer can enhance the plating ability of Cu on Al substrate.In this paper, a method for fabricating Al/Cu composite was introduced by electroless plating Ni-P alloy layer followed by e-lectroplating Cu.Planar and cross-sectional morphologies,compositions and formation mechanism of the elec-trolessplating Ni-P alloy layer and microstructure and electrical properties of the Al/Ni-P/Cu composite were investigated.The results show that Ni-P alloy particles are preferentially deposited on corrosion pits and em-bossments on Al surface,and gradually a continuous Ni-P alloy film was formed.A uniform and dense Ni-P al-loy layer of 5μm in thickness was deposited on Al substrate after electroless Ni-P alloy plated in the alkali solu-tion for 5 min and the in the acidic solution for 25 min.After electroplating a thick Cu layer of 140μm in thick-ness,the Al/Ni-P/Cu composite has an electrical resistivity of 2.92×10-8 Ω.m.After heat treated at 150 ℃for 360 h,interdiffusion between Al and Cu is not detected,and electrical resistivity of the Al/Ni-P/Cu com-posite is just 3.04×10-8 Ω.m,indicating that microstructure and electrical resistivity of the composite are ex-tremely steady.

关 键 词：NI-P合金 层状复合材料 化学镀 电镀 电阻率 

分 类 号：TQ153.1[化学工程—电化学工业]