泡沫石墨基复合相变材料储热过程的数值研究  

Numerical Simulation of Thermal Storage Process of Composite Phase Change Material with Graphite Foam

作　　者：贾艾兰 邢玉明[1] 

机构地区：[1]北京航空航天大学航空科学与工程学院,北京100191

出　　处：《电子器件》2016年第4期759-763,共5页Chinese Journal of Electron Devices

摘　　要：采用数值仿真的方法,对填充单一相变材料(石蜡、Cerrolow-136合金(49%Bi-21%In-18%Pb-12%Sn))和泡沫石墨基复合相变材料的相变温控装置PTCC(Phase change thermal control component)的储热性能进行研究,对比分析两类温控装置对电子发热元件表面温度的控制效果。结果表明:在芯片功率为25 W、工作时长30 min条件下,含泡沫石墨基复合相变材料的PTCC对芯片表面的温度控制比含有单一相变材料的控制温度更低,并且对于芯片到达温度上限(75℃)的控制时间也有所延长。泡沫石墨材料的应用提高了相变材料的储热性能,同时也满足了电子设备的温控要求。The investigation is taken to research the thermal control performance of Phase-Change Thermal Control Component（PTCC）filled with composite phase change materials and pure phase change materials （paraffin and Cerrolow-136 alloy）, and study their thermal control effect for the surface temperature of heat source. The results show that under 25 W heating power and after 30 minutes of heating, the surface temperature of the heat source controlled by Phase change thermal control component with graphite foam composite materials is lower than that PTCC with pure phase change materials controlled, and under graphite foam composite PCMs＇ thermal control, the spend- ing time of heating that the temperature arrived to limit （75 ℃ ）is extended longer than that PTCC with pure phase change materials. The graphite foam material improves the thermal storage properties of the phase change materials and meets the requirement of electronic equipment thermal control.

关 键 词：电子器件 泡沫石墨 数值仿真 相变温控技术 

分 类 号：TB333[一般工业技术—材料科学与工程]