苯并噁嗪树脂在绝缘材料中的应用研究  

Application Research of Polybenzoxazines in Insulating Materials

作　　者：杨坡[1] 顾宜[1] 

机构地区：[1]四川大学高分子科学与工程学院,高分子材料工程国家重点实验室,成都610065

出　　处：《绝缘材料》2016年第10期12-16,共5页Insulating Materials

基　　金：国家自然科学基金资助项目(21204053);四川大学优秀青年学者科研基金(2015SCU04A07)

摘　　要：苯并噁嗪树脂是一种新兴的热固性树脂,拥有良好的阻燃性能、耐热性能和力学性能等,具有广阔的应用前景和较高的研究价值。本文概述了苯并噁嗪树脂的化学结构和聚集态结构,分析了结构对树脂介电性能的影响,重点介绍了苯并噁嗪复合材料的介电性能,并对苯并噁嗪树脂在电子电器领域更广泛的应用进行了展望。As a kind of novel thermosetting resin, polybenzoxazine has wide application prospect and high research value because of its excellent flame retardancy, heat resistance, and mechanical properties. In this paper, the chemical and aggregation strucres of polybenzoxazines were reviewed, and the effect of structures on the dielectric property of polybenzoxazines was summarized. The dielectric property of polybenzoxazines-based composites was emphatically introduced, and the applications of polybenzoxazines in electronic appliances were proposed.

关 键 词：苯并噁嗪 结构 热固性树脂 电子电器 

分 类 号：TM215.1[一般工业技术—材料科学与工程]