Microstructures and properties of Al-50%SiC composites for electronic packaging applications  

电子封装用Al-50%SiC复合材料的组织和性能（英文）

作　　者：滕飞[1,2] 余琨[1,2] 罗杰[1] 房宏杰 史春丽[1] 戴翌龙[2] 熊汉青[2] 

机构地区：[1]烟台南山学院材料科学与工程学院,烟台265713 [2]中南大学材料科学与工程学院,长沙410083

出　　处：《Transactions of Nonferrous Metals Society of China》2016年第10期2647-2652,共6页中国有色金属学报（英文版）

基　　金：Project support by the 2015 Shandong Province Project for Outstanding Subject Talent Group,China

摘　　要：Al？50%SiC （volume fraction） composites containing different sizesofSiC particles （average sizesof 23, 38 and 75 μm） were prepared by powder metallurgy. The influences of SiC particle sizes and annealing on the propertiesof the compositeswere investigated. The results show that SiC particles are distributed uniformly in the Al matrix. The coarse SiC particles result in higher coefficient of thermal expansion （CTE） and higher thermal conductivity （TC）, while fine SiC particles decrease CTE and improve flexural strength of the composites. The morphology and size of SiC particles in the composite are not influenced by the annealing treatment at 400℃for 6h. However, the CTE and the flexural strength of annealed composites are decreased slightly, and the TCis improved. The TC, CTE and flexural strength of the Al/SiC composite with averageSiC particlesize of75 μm are 156 W/（m·K）, 11.6×10^-6K^-1 and 229 MPa, respectively.采用粉末冶金法制备体积分数为50%、不同SiC颗粒尺寸(平均尺寸为23、38和75μm)的Al/SiC复合材料。研究SiC颗粒尺寸和退火对Al/SiC复合材料组织和性能的影响。结果表明,在所得复合材料中,SiC颗粒均匀分布在铝基体中。粗Si C颗粒能提高材料的热膨胀系数和热导率,细SiC颗粒降低材料的热膨胀系数和提高抗弯强度。经过400°C、6 h退火后,SiC颗粒的尺寸和形态没有发生变化,但材料的热膨胀系数和抗弯强度降低,热导率增大。退火后,SiC颗粒尺寸为75μm复合材料的热导率为156 W/(m·K),热膨胀系数为11.6×10^(-6)K^(-1),抗弯强度为229 MPa。

关 键 词：Al-50％SiC composites powder metallurgy thermal properties flexural strength electronic packagingmaterial 

分 类 号：TB333[一般工业技术—材料科学与工程]