一种新型功放机箱的散热设计  

Thermal Design of a New Power Amplifier

作　　者：高利民[1] 贾伟妙[1] 

机构地区：[1]中国电子科技集团公司第五十四研究所,石家庄050081

出　　处：《机械工程师》2016年第11期202-204,共3页Mechanical Engineer

摘　　要：针对某型号功放的小型化、防雨及快速维修的设计要求,提出一种新型机箱散热的结构形式,该机箱体积小,且各模块的安装、拆卸互不影响。通过理论计算选取散热器初始参数,但仿真结果显示功率管工作温度高于85℃。对仿真结果分析后提出采用铝外壳嵌入紫铜块和减小散热器肋间距两项优化措施,仿真结果显示这两项措施均可明显改善机箱散热性能;优化后功率管满足工作温度低于85℃的指标。This paper provides a new structure of cooling chassis for the miniaturization, rainproof and quick maintenance design of power amplifier. The chassis has a small volume, and the modules in the chassis can be installed and removed without interference. By theoretical calculation, initial parameters of the heat sink are selected, but the work temperature of the power transistor is shown above 85^1 through simulation. Two optimization measures including embedding copper block into aluminum shell and reducing the fin space of the heat sink are provided after analyzing the simulation results. Then the simulation results show that the measures can improve the cooling capability obviously and the work temperature of the power transistor can meet the demand of below 85X1.

关 键 词：功放 热设计 热仿真 优化 

分 类 号：TK123[动力工程及工程热物理—工程热物理]