紫铜感应钎焊接头组织及性能  

Microstructure and properties of copper induction soldering joint

作　　者：孟涛[1] 戴军[1] 李栋梁[1] 张尧成[1] 杨莉[1] 蒋立成 

机构地区：[1]常熟理工学院汽车工程学院,江苏常熟215500

出　　处：《电焊机》2016年第10期31-33,共3页Electric Welding Machine

基　　金：江苏省自然科学基金项目(SBK2014020827);江苏省大型工程装备检测与控制重点建设实验室开放课题(JSKLEDC201507)

摘　　要：以紫铜板材为对象,利用Sn-58Bi和Sn-0.7Cu钎料对紫铜进行感应钎焊实验,保温不同的时间,采用光学显微镜、显微硬度计、接合强度测试仪等方法对钎焊接头进行组织分析和性能测试。结果表明,利用Sn-58Bi和Sn-0.7Cu钎料和感应钎焊技术可以实现紫铜的连接。Sn-58Bi感应钎焊接头界面处均形成了一层薄而连续的金属间化合物Cu6Sn5。随着保温时间的增加,焊缝中富Bi相逐渐减少。Sn-0.7Cu钎料接头的显微硬度在保温时间为10 s时最大。随着保温时间的增加,金属间化合物层厚度逐渐增加,接头强度随之降低。Soldering experiments of copper are investigated using Sn-58Bi and Sn-0.7Cu sohler in this paper. Mierostructure and mechanical properties of welding joints are studied. The resuhs show that the copper can he well welded using Sn-58Bi and Sn-0.7Cu solder with induction soldering technology. The IMC layer Cu6Sn5 is generated at the interface of weMing joints using Sn-58Bi solder. The Bi rich phase in the solder decreases gradually with the increase of the holding time. The mierohardness of sohler is the largest when the holding time is 10 s using Sn-0.7Cu sohler. The thickness of IMC layer increases and the tensile strength of welding joints decrease with Ihe increase of the holding time.

关 键 词：感应钎焊 Sn-58Bi钎料 Sn-0.7Cu钎料 微观组织 

分 类 号：TG454[金属学及工艺—焊接]