电子设备液冷技术研究进展  

Research Development of Liquid Cooling Techniques for Electronic Equipment

作　　者：周海峰[1] 邱颖霞[1] 鞠金山[1] 瞿启云 白一峰[1] 李磊[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《电子机械工程》2016年第4期7-10,15,共5页Electro-Mechanical Engineering

摘　　要：随着电子设备发热功率密度的不断增加,传统的风冷已经无法满足高热流密度电子设备的散热。液冷技术是通过液冷介质与热源接触进行热交换,再由冷却液体将热量传递出去,具有高换热系数、良好的流动性及稳定的工作能力,因而成为现代电子设备冷却系统的首选。为了进一步适应新型电子设备的高性能、高可靠、低成本的发展趋势,液体冷却方式需要在理论分析和优化结构上做进一步的研究。文中首先综述了几种常用的液冷技术的原理、特点、研究动态和工程应用,并提出了液冷技术发展的趋势。With the power density increase of electronic equipment, traditional air cooling can not meet the heat dissipation requirements of high-heat-flux electronics. Liquid cooling techniques that transfer heat through cooling liquid contacting with heat source present high heat transfer coefficient, good liquidity and stable work- ing ability, and therefore become the first choice of modem electronic equipment cooling system. In order to further accommodate the trend of high performance, high reliability and low cost of new electronic equipment, liquid cooling needs further research on theory analysis and optimizing structure. The paper firstly presents the principles, characteristics, research developments and engineering applications of several common liquid cooling techniques, and then puts forward the development trend of liquid cooling.

关 键 词：电子设备 散热 液冷 

分 类 号：TK124[动力工程及工程热物理—工程热物理]