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作 者:张立眉[1] 高建峰[2] 王宇[2] 胡拖平[2] 安富强[2] 欧国利 王艳君[2] 王军勤
机构地区:[1]中国铝业公司,北京100082 [2]中北大学理学院,山西太原030051
出 处:《材料科学与工程学报》2016年第5期780-783,810,共5页Journal of Materials Science and Engineering
基 金:国家国际科技合作专项资助项目(2011DFA51980);山西省科技合作专项资助项目(2011DFA51980);山西省自然基金资助项目(2013011040-3);煤转化国家重点实验室基金资助项目(J12-13-309);山西省攻关项资助项目(20130321022-02)
摘 要:以羧甲基壳聚糖(CMC)为原料,Cu(Ⅱ)为模板离子,环氧氯丙烷(ECH)为交联剂,制得交联印迹材料Cu-ECMC。研究了该材料对模板离子的结合性能与识别选择性。探讨了溶液的pH值、吸附时间等因素对该材料吸附性能的影响。结果表明,材料Cu-ECMC对Cu(Ⅱ)可产生吸附作用,最大吸附量达到44.3mg·g^(-1);pH=3.0时,相对于La(Ⅲ),对Cu(Ⅱ)的选择性系数可达到15.57。印迹材料对铜离子的吸附符合准二级动力学模型。In this work, the cross-linked imprinted materials Cu-ECMC with Cu (lI) ions in sulfate solution as template was prepared by using carboxymethyl chitosan as raw material and epichlorohydrin as cross-linking agent. The binding properties and recognition selectivity of the template ion were studied, and various adsorption factors were further studied, including initial pH value and adsorption time. The results show that the Cu-ECMC towards Cu(Ⅱ ) ions can produce strong adsorption, the maximum adsorption capacity is 44.3mg·g-l; pH= 3. 0, with respect to the La(Ⅲ), selectivity coefficient of Cu(Ⅱ) is 15.57. The adsorption behavior of Cu2+ on Cu-ECMC can be well described by the Pseudo-second order model.
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