Ag对Sn9Zn钎料组织及微米压痕性能的影响  

Effect of Agon microstructure and property of microindentation of Sn9Zn solder

作　　者：吴敏[1] 李金权[1] 

机构地区：[1]辽宁石油化工大学机械工程学院,辽宁抚顺113001

出　　处：《金属功能材料》2016年第5期11-14,共4页Metallic Functional Materials

基　　金：辽宁省教育厅科学研究计划项目资助(2008382);辽宁石油化工大学科学基金项目资助(xjj-2013005)

摘　　要：运用X射线衍射仪、扫描电镜和能谱分析、微米压痕仪等仪器设备,研究添加质量分数为1%Ag对Sn9Zn钎料组织及微米压痕性能影响。结果表明,基于键参数函数理论计算及实验分析结果均表明,Ag优先与Zn形成AgZn3化合物。元素Ag能使Sn9Zn钎料压痕深度相对下降11%,压痕硬度增大28%,达到0.32GPa。研究认为Ag和Zn在钎料中以金属间化合物形式存在且弥散分布于基体内是钎料微米压痕性能得到显著改善的根本原因。Effect of the content of 1%Ag（mass fraction）on microstructure and property of microindentation of Sn9 Zn solder was investigated by means of XRD、SEM and micro hardness tester etc.The results show that element Ag and Zn might form AgZn3 compound based on the calculation from theory of bond parameter function and experimental analysis.Due to Ag in the solder,the indentation displacement of Sn9 Zn solder relative declines 11%,and its indentation hardness increases by 28%,reaching to 0.32 GPa.The reason that the property of microindentation of Sn9 Zn solder is improved is existence and distribution of the intermetallic compound of Ag-Zn in the solder.

关 键 词：金属材料 AG Sn9Zn钎料 组织 微米 微米压痕 

分 类 号：TG425[金属学及工艺—焊接]