印制电路板微孔超高速机械钻孔工艺研究  

Technological Research on Printed Circuit Board Ultra High-speed Mechanical Drilling

作　　者：何玲[1,2] 王志刚 吴恒玉[1] HE Ling WANG Zhigang WU Hengyu(Hainan college of software technology, Qionghai 517400, China Guangdong Technical College of Water Resources and Electric, Guangzhou, 510000, China Han＇s laser Technology Co., Ltd, Shenzhen 518052, China)

机构地区：[1]海南软件职业技术学院,海南琼海517400 [2]广东水利电力职业技术学院,广东广州510000 [3]深圳市大族激光科技股份有限公司,广东深圳518052

出　　处：《电子工业专用设备》2016年第10期14-21,41,共9页Equipment for Electronic Products Manufacturing

基　　金：2014年海南省自然科学基金项目614239

摘　　要：针对印刷电路板微孔超高速机械钻孔工艺问题,通过Kistler高精密微型测力系统测试钻孔切削力,配合红外温度摄像仪监测钻头温度,以钻孔质量为优化目标,运用实验设计(DOE)正交分析方法,对钻孔加工中影响钻孔质量的各种工艺参数进行分析,优化加工条件和加工工艺,确定较优的钻孔参数,以满足数控机械钻孔机对BGA封装的IC载板板材钻孔的要求。This paper introduced the primed circuit board micro-holes ultra high-speed mechanical drilling process issues, by Kistler high precision miniature drill cutting force dynamometer test systems, detected the drilling temperature with infrared temperature cameras, the quality is optimize of the target, the Design of Experiments （DOE） orthogonal was used of analysis method, the influence of borehole drilling quality of various process parameters were also analyzed to determine the optimum drilling parameters to optimize processing conditions and processing technology to meet the BGA package IC carrier plate drilling requirements with CNC machine drilling.

关 键 词：印制电路板 微孔 机械钻削 工艺研究 

分 类 号：TN605[电子电信—电路与系统]