金银合金板杂质控制的生产实践  

The production practice of Gold and Silver alloy plate material control

作　　者：李志 杨其壬 童章启 

机构地区：[1]江西铜业铅锌金属有限公司,江西九江332500

出　　处：《铜业工程》2016年第5期69-70,73,共3页Copper Engineering

摘　　要：银电解对于合金板杂质的要求比较严格,分银炉传统火法冶炼对于杂质Cu、Bi的控制较差——杂质Cu难以降低,杂质Bi容易出现"返弹"。因此,通过查阅文献资料以及生产过程进行研究分析,采用金属A来实现除Cu稳Bi的目的。silver electrolysis is strict to the requirement of impurities on the alloy board, silver smelting furnace of traditional method for impurity control poor Cu, Bi - impurities Cu is difficult to reduce, impurity Bi prone to ＂return＂. Therefore, through the consult literature material, and through analyzing the production process, use A metal to achieve the goal of stable except Cu Bi.

关 键 词：氧化精炼 新工艺 杂质控制 合金板 合格率 

分 类 号：TF832[冶金工程—有色金属冶金]