基于CFD数值计算的电子设备热设计分析  

Thermal Design Analysis of Electronic Equipment Based on CFD Numerical Calculation

作　　者：周晓东 张磊 郑超 吴强国 张东 翟众福 ZHOU Xiao-dong ZHANG Lei ZHENG Chao WU Qiang-guo ZHANG Dong ZHAI Zhong-fu(TBEA Xi＇an Electric Technology Co. , Ltd. , Xi＇an 710071, China)

机构地区：[1]特变电工西安电气科技有限公司,陕西西安710071

出　　处：《电子机械工程》2016年第5期1-7,共7页Electro-Mechanical Engineering

基　　金：国家863计划资助项目(2011AA05A305)

摘　　要：以高功率密度的有源滤波器产品热设计为例,快速建立数字化样机模型,运用CFD(Computational Fluid Dynamics)数值仿真手段,分析不同布局下温度场、速度场各自利弊,通过对比电感横向和纵向布局,抽风或鼓风散热方式差异,定量分析IGBT模块的均温度,计算电感所在区域的速度场分布。在保证系统风阻符合风扇工作点稳定可靠的前提下,再对散热截面尺寸进行优化,解决IGBT模块局部过热的潜在风险。其次,将物理样机的热测试与热仿真数据进行对比,半导体器件壳温相对误差小于7%,绝对误差小于4.7℃,已满足工程应用要求。文章从产品热设计角度出发,运用数值建模及仿真可以快速甄别系统中过热风险点、风机工作点匹配合理,从而针对问题本身进行优化分析,提出切实可行的解决方案。High power density and active power filter thermal design, for instance, to build digital prototype rapidly, use of CFD numerical simulation, analysis of temperature field and velocity field under different lay- out their respective advantages and disadvantages, by comparing differences of the inductor both horizontal and vertical layouts, exhaust or blower cooling mode, temperature difference among IGBT（ Insulated Gate Bipolar Transistor） modules is quantitatively analyzed, calculate the velocity field distribution in the area where the in- ductance is located. In premise of system resistance in line with stability and reliability of the fan operating point, and then the cross-sectional dimensions are optimized to address the potential risk of local overheating IGBT module. Second, the physical prototype thermal test and thermal simulation data are compared, the case temperature of semiconductor device relative error less than 7%, the absolute error is less than 4.7 ~C, has met the requirement of engineering application. Significance of this paper is the product thermal design point of view, the use of numerical modeling and simulation of the system can quickly identify the risk of overheating point and the fan operating point match reasonability, optimization is conducted for the problem itself and thus practical solutions is put forward.

关 键 词：系统热分析 热设计过程 方案对比 高功率密度 

分 类 号：TK414.212[动力工程及工程热物理—动力机械及工程]