一种典型性化镍金漏镀现象分析  被引量:1

Analysis of a typical skip plating phenomenon in ENIG

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作  者:张鹏伟 陈黎阳 罗畅 郝强立 吉梦婕 

机构地区:[1]广州兴森快捷电路科技有限公司,广东广州510663 [2]深圳市兴森快捷电路科技股份有限公司,广东深圳518054

出  处:《印制电路信息》2016年第A02期130-134,共5页Printed Circuit Information

摘  要:近年来,在无铅化的大背景下,PCB产业随之发生重大变化,表面处理工艺亦如此。沉金工艺在诸多选择中可谓异军突起,因其固有的优点,其所占比重迅速提高,当前已经占据PCB总量的半壁江山。漏镀是化学镀镍金生产中经常出现的问题,但本研究中的漏镀现象为塞孔不良或油墨入孔所致焊盘漏镀。与常规的漏镀有不同之处。本文从电化学角度解析了此种漏镀的机理,并通过一定的改善措施对此漏镀问题进行了改善。The PCB products had been greatly changed in the past few years under the demand of lead- free, and the same to the surfer treatment process. The eleetroless nickel/immersion gold(ENIG)become more popular than the other surfer treatment process because of its advantage, and its market share was flourished. Skip plating is a recurrent problem in the electroless nickel and immersion gold process, but the uncoated phenomenon for Incomplete Solder Mask Plugging or Solder Mask into the hole caused Skip plating. There are differences with conventional uncoated in the study. In this paper, we analyzed the Skip plating from the view of electrochemistry and gave some improvement measures to improve the Skip plating problem.

关 键 词:化学镀镍 化学镀金 漏镀 

分 类 号:TN41[电子电信—微电子学与固体电子学]

 

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