氧化铝陶瓷降温过程中残余应力形成的计算机仿真分析  

The Simulation Analysis of The Residual Stress which Product in The Cooling Process of Sintering Alumina Ceramic Plate by Computer

作　　者：郭文飞[1] 郑兴益[1] 薛志岗[1] 伦文山 周瑞[1] 

机构地区：[1]江苏省陶瓷研究所有限公司,宜兴214221 [2]江苏久吾高科技股份有限公司,南京210000

出　　处：《江苏陶瓷》2016年第5期20-23,共4页Jiangsu Ceramics

摘　　要：本文采用ANSYS软件,对大尺寸氧化铝陶瓷原板烧成降温过程中形成的残余应力进行仿真分析。通过分析得到,陶瓷残余应力的形成主要是由于烧成后高温蠕变产生的应力松弛导致的。在高温段存在较大的温度梯度和热应力,进而导致蠕变发生,引起应力松弛。随着温度降低,蠕变停止,应力随温度梯度减小而增大,当降到室温时,温度梯度消失,应力被保存下来。在沿径向和垂直于径向存在较大的残余应力。径向方向残余应力且从中心(50.5MP)向外衰减(0.235MP);垂直于径向方向从中心(50.5MP)向外衰减(-101MP)。This article use the ANSYS software to analysis residual stress of the large size of alumina ceramic disc, which producted in firing cooling process. It obtained by analysis that the residual stress is mainly due to the high temperature creep produced by the result of stress relaxation. In the high temperature period, the larger temperature gradient and thermal stress leaded to creep, which caused the stress relaxation. Along with the temperature lowering the creep stoped, while the stress increase with the decrease of the temperature gradient. When down to room temperature, temperature gradient annihilate, but the stress has been preserved. In the radial direction the Residual stress attenuated from the center （50.5 MP） tooutward （0.235 MP）.

关 键 词：ANSYS 残余应力 高温蠕变 应力松弛 

分 类 号：TQ174.1[化学工程—陶瓷工业]