无规共聚法及共混法制备PMDA-ODA/PDA薄膜及其性能研究  

Properties of PMDA-ODA/PDA Film Prepared by Random Copolymerization and Blending

作　　者：青双桂[1] 白小庆[1] 刘鑫雨 韩艳霞[1] 蒋耿杰[1] 黄孙息[1] 

机构地区：[1]桂林电器科学研究院有限公司,广西桂林541004

出　　处：《绝缘材料》2016年第11期51-54,共4页Insulating Materials

基　　金：桂林市科学研究与技术开发计划项目(2016010705)

摘　　要：在均苯四甲酸二酐-二氨基二苯醚(PMDA-ODA)分子结构中引入刚性对苯二胺(PDA),通过无规共聚法和共混法制备PI薄膜,采用XRD、TMA、TGA和万能试验机对薄膜聚集态结构及物理性能进行表征。结果表明:引入PDA后PI薄膜的拉伸强度和弹性模量提高,断裂伸长率下降,热膨胀系数和玻璃化转变温度降低。与无规共聚PI相比,共混法制备的PI热膨胀系数更低,弹性模量更高,热膨胀系数和弹性模量分别为9.2×10^(-6)/℃和3.7 GPa,且衍射峰强度更大,玻璃化转变温度更高。说明采用共混法制备的PMDA-ODA/PDA薄膜可以提高分子聚集态结构的有序化程度,改善其性能。The rigid structure of p-phenylenodiamine （PDA） was introduced into the pyromeltitic dianhy- dride-diaminodiphenyl ether （PMDA-ODA） molecular chain, and polyimide （PI） films were prepared by random copolymerization and blending. Their aggregation structure and properties were characterized by XRD, TMA, TGA, and universal tester. The results show that the tensile strength and elastic modulus of the PI films after introducing PDA increase, and the elongation at break, coefficient of thermal expansion （CTE）, and glass transition temperature decrease. Compared with the PI films prepared .by random copoly- merization, the PI films prepared by blending have lower CTE, larger elastic modulus, bigger X-ray diffraction peak, and higher glass transition temperature, and the CTE and elastic modulus is 9.2× 10^（-6）/℃and 3.7 GPa respectively, which indicate that the PMDA-ODA/PDA film prepared by blending has higher regularity of molecular structure, so its properties are improved.

关 键 词：无规共聚 共混 对苯二胺 聚酰亚胺薄膜 

分 类 号：TM215.3[一般工业技术—材料科学与工程]