硫酸钡共沉淀法除去MSA电镀锡液中的铅  

Removal of lead from MSA tin electroplating bath by coprecipitation with barium sulfate

作　　者：唐薇[1] 秦宗慧[1] 潘红良[1] 陈建钧[1] 陈延星 TANG Wei QIN Zong-hui PAN Hong-liang CHEN Jian-jun CHEN Yan-xing(School of Mechanical and Power Engineering, East China University of Science and Technology, Shanghai 200237, Chin)

机构地区：[1]华东理工大学机械与动力工程学院,上海200237

出　　处：《电镀与涂饰》2016年第21期1131-1135,1147,共5页Electroplating & Finishing

摘　　要：探讨了采用硫酸钡共沉淀法去除甲磺酸(MSA)镀锡液中铅杂质的可行性,重点研究了沉淀剂(Ba(OH)_2·8H_2O)的投入量、反应时间及沉降时间对除铅效果的影响。使用扫描电镜(SEM)、能谱(EDS)、X射线衍射(XRD)、激光粒度分析等方法对共沉淀物进行表征。结果表明,当Ba^(2+)/Pb^(2+)摩尔比为25,反应时间为30 min时,所得共沉淀的粒度最大,镀液中的铅含量从16.11 mg/L降至0.70mg/L,而延长沉降时间有利于进一步降低镀液中的铅含量。共沉淀物主要为(Ba_(0.69)Pb_(0.31))SO_4。The feasibility of removing Pb impurity from methanesulfonic acid （MSA） Sn electroplating bath by coprecipitation with BaSO4 was studied. The effects of the dosage of Ba（OH）2·8H2O as precipitating agent, reaction time and sedimentation time on removal of Pb were discussed. The co-precipitate was characterized by scanning electron microscopy （SEM）, energy-dispersive spectroscopy （EDS）, X-ray diffraction （XRD） and laser particle size analysis. The results showed that reacting at a Ba2＋-to-Pb2＋ molar ratio of 25 for 30 min produces the co-precipitate with largest particle size and reduces the Pb concentration from 16.11 mg/L to 0.70 mg/L. The extension of sedimentation time is conducive to further reduction of Pb content of the Sn electroplating bath. The co-precipitate is mainly composed of （Ba0.69Pb0.31）SO4.

关 键 词：电镀锡 甲磺酸 铅杂质 氢氧化钡 共沉淀 去除 

分 类 号：TQ153.13[化学工程—电化学工业]