碳纤维化学镀铜工艺  

Technology for Electroless Copper Plating on Carbon Fiber

作　　者：赵振兴[1] 杨永顺[1] 杨茜[1] 胡珊[1] 董志翔 

机构地区：[1]河南科技大学有色金属共性技术河南省协同创新中心,河南洛阳471023

出　　处：《电镀与环保》2016年第6期20-22,共3页Electroplating & Pollution Control

基　　金：国家自然科学基金资助项目(51105132)

摘　　要：对碳纤维进行了去胶、粗化、敏化、活化、解胶等预处理,然后在其表面化学镀铜。当采用电动搅拌方式、镀液中碳纤维的质量浓度为3.0g/L、pH值为12.0时,碳纤维分散均匀、无团聚,化学镀铜层均匀。结合力测试结果表明,化学镀铜层的结合力达到要求。Carbon fiber was pre-treated respectively by removing glue, roughening, sensitization, activation and dispergation, and then electroless copper plating on the surface. When adopting electric stirring, the mass concentration of carbon fiber in plating solution was 3.0 g/L and the pH value was 12.0, carbon fiber disperse uniformly and without agglomeration, and the electroless copper coating was uniform. Binding force test results showed that the binding force of electroless copper coating meet the requirement.

关 键 词：碳纤维 化学镀 PH值 

分 类 号：TQ153[化学工程—电化学工业]