活化工艺对化学镀镍的影响  

Effect of Activation Process on Electroless Nickel Plating

作　　者：李卓[1] 戴玲[1] 黄小兵[1] 陈红辉 郭欣[1] 罗敏[1] 

机构地区：[1]湖南文理学院化学化工学院,湖南常德415001 [2]常德鑫睿新材料有限公司,湖南常德415000

出　　处：《电镀与环保》2016年第6期22-24,共3页Electroplating & Pollution Control

基　　金：湖南省重点学科项目(应用化学);常德市科技计划项目(2015J083)

摘　　要：研究了一种以塑料为基材进行导电化处理的高稳定性离子钯活化工艺,并将其与胶体钯活化工艺进行比较。结果表明:与胶体钯活化工艺相比,离子钯活化工艺能有效提高化学镀镍层的形貌质量、硬度及光泽度。A kind of high stability ionic palladium activation process, which using plastic as substrate and was treated to become electric conductive, was studied. And it was compared with the colloidal palladium activation process. Results showed that, compared with the colloidal palladium activation process, the ionic palladium activation process can effectively improve the morphology quality, hardness and gloss of electroless nickel coating.

关 键 词：活化 化学镀 胶体钯 离子钯 

分 类 号：TQ153[化学工程—电化学工业]