银粉形貌及粒径对银浆性能的影响  

Effects of Morphology and Particle Size of Silver Powder on Properties of Silver Paste

作　　者：滕媛[1] 甘国友[1] 李文琳 杜景红[1] 严继康[1] 易建宏[1] 

机构地区：[1]昆明理工大学材料科学与工程学院,昆明650093 [2]贵研铂业股份有限公司,昆明650106

出　　处：《贵金属》2016年第B11期58-63,共6页Precious Metals

基　　金：国家自然科学基金(51262017;51362017);稀贵金属先进材料协同创新中心协同创新基金(14051708);稀贵金属综合利用新技术国家重点实验室开放课题(SKL-SPM-201502)

摘　　要：将银粉、有机载体和玻璃粉按一定比例混合制成导电银浆。银浆通过丝网印刷在硅基片上,保温烧结。采用SEM、四探针法研究银粉的不同粒径与形貌对银浆烧结厚膜层方阻的影响。结果表明,随着球形银粉粒径增大,银膜方阻先减小后增大,当球形银粉粒径在2μm时银膜方阻最小,为4.44?/□;当2μm片状银粉和2μm球形银粉混合加入时,银膜方阻最小,为3.95 m?/□;随着片银的含量增加,银膜方阻先减小后增大,当片状银粉为50%时银膜方阻最小,为3.92 m?/□。The silver paste was prepared by mixing the glass flit, silver powder and organic vehicle with a certain proportion. The silver paste was printed on Si substrate by the way of silk screen printing and then sintered under a given temperature. The influence of particle size and morphology of silver powders on square resistance of Ag film was investigated by SEM and four probe method. The results showed that the silver film square resistance decrease first and then increase as the particle size of silver powder increase. The silver film square resistance reaches the minimum 4.44 mΩ/□ at the silver powder particle size of 2μm. The silver film square resistance reaches the minimum 3.95mΩ/□ when the 2μm flake silver powder and 2μm spherical silver powder are mixed added in. The silver film square resistance decrease first and then increase as the content of flake silver powder increase. The silver film square resistance reaches the minimum 3.92 mΩ/□ at the flake silver powder content of 50%.

关 键 词：银浆 片状银粉 银膜方阻 

分 类 号：TB34[一般工业技术—材料科学与工程]