强流脉冲电子束诱发的Cu-C扩散合金化  

Diffusion alloying of Cu-C induced by high current pulsed electron beam

作　　者：关庆丰[1] 黄尉[1] 李怀福[1] 龚晓花 张从林[1] 吕鹏[1] 

机构地区：[1]江苏大学材料与科学工程学院,江苏镇江212013

出　　处：《吉林大学学报（工学版）》2016年第6期1967-1973,共7页Journal of Jilin University:Engineering and Technology Edition

基　　金：国家自然科学基金委员会-中国民用航空局联合基金项目(U1233111);江苏省博士后基金项目(1501159B);江苏大学高级人才科研启动基金项目(14JDG127);大连理工大学三束实验室开放课题项目(LABKF1504)

摘　　要：采用真空烧结技术制备了w(C)=6%的Cu-C(其中C为片状石墨)块状复合材料,利用强流脉冲电子束(HCPEB)技术对样品进行表面辐照处理,辐照次数分别为1、5、20和40。利用X-ray衍射仪(XRD)、扫描电子显微镜(SEM)以及透射电子显微镜(TEM)详细分析了辐照样品的相组成和微观结构,并考查了经HCPEB辐照处理后样品表面的摩擦磨损性能。XRD结果表明:经HCPEB辐照后,衍射峰向高角度偏移,Cu-C间发生固溶,部分C原子与Cu原子形成间隙固溶体,理论计算结果显示最大固溶度达到2.24%。微结构分析结果表明:辐照表面形成高密度的Cu、C纳米晶粒,并在基体Cu中诱发了高密度晶体缺陷,这些结构为C原子的扩散提供了大量的扩散通道。此外,经HCPEB技术处理后材料表面的摩擦磨损性能得到了明显改善。High Current Pulsed Electron Beam （HCPEB） was employed for the surface irradiation of Cu-C composite material made by high sintering, where C is in the form of flake graphite. The irradiating times were 1, 5, 20 and 40 respectively. The phase composition and microstructure of the irradiated samples were analyzed in detail using XRD, SEM and TEM. The surface friction and wear properties of the irradiated samples were also examined. Results of XRD indicate that the diffraction peak shifts to high angle after HCPEB irradiation, and the solid solution occurs between Cu-C. Furthermore, C atoms and Cu atoms forms interstitial solid solution partly, and the maximum calculated solid solubility reaches 2. 24M. Microscopic results show that high density Cu and C nanoparticles are formed on the irradiated surface, and high density crystal defect is induced in the matrix Cu at the same time, which provides a large number of diffusion channels for the diffusion of C atoms. Furthermore, the friction and wear properties of the material are improved obviously after HCPEB irradiation.

关 键 词：金属材料 强流脉冲电子束 Cu-C复合材料 固溶体 扩散 摩擦磨损性能 

分 类 号：TG156[金属学及工艺—热处理]