Thermal expansion behavior, microhardness and electrochemical corrosion resistance properties of Au_(52)Cu_(27)Ag_(17-x)(NiZn_(0.5))_x alloys  

Au_(52)Cu_(27)Ag_(17-x)(NiZn_(0.5))_x合金的热膨胀行为、显微硬度和电化学耐腐蚀性能（英文）

作　　者：神克常[1] 李桂华 王伟民[1] 

机构地区：[1]山东大学材料液固结构演变与加工教育部重点实验室,济南250061 [2]山东省计量科学研究院,济南250014

出　　处：《Transactions of Nonferrous Metals Society of China》2016年第11期2900-2909,共10页中国有色金属学报（英文版）

基　　金：Projects(51171091,51471099,51571132)supported by the National Natural Science Foundation of China;Project(2012CB825702)supported by the National Basic Research Program of China

摘　　要：The thermal expansion behavior, microhardness and electrochemical corrosion resistance of Au52Cu27Ag17-x（NiZn0.5）x （x=0,6 and 12） alloys were investigated by dilatometer （DIL）, microhardness tester, electrochemical workstation, X-ray diffractometer（XRD）, scanning electron microscopy （SEM）, transmission electron microscopy （TEM） and X-ray photoelectron spectroscopy （XPS）.With increasing x, the relative length expansion and DIL maximum temperature Tl m （i.e., thermal stability） of the alloys increase inthermal expansion measurements, which can be explained by the change of the atomic binding energy, mismatch entropy togetherwith phase transformation. With the increase of x, the microhardness can be improved, but the corrosion resistance decreases; inaddition, the anodic peak current densities of polarization curves decrease, which are related closely with the solid solution degreeand dissolution of Ag, Ni and Zn alloying elements in Cl^- -containing solution.利用热膨胀仪(DIL)、显微硬度计、电化学工作站、X射线衍射仪(XRD)、扫描电子显微镜(SEM)、透射电子显微镜(TEM)、X射线光电子能谱(XPS)研究了Au_(52)Cu_(27)Ag_(17-x)(NiZn_(0.5))_x (x=0,6,12)合金的热膨胀行为、显微硬度和电化学耐腐蚀性。随着x的增加,在热膨胀实验测试中合金的相对长度膨胀量和DIL曲线极大值的温度T_(lm)(即热稳定性)增加,这可以归因于原子结合能、错配熵的变化以及相变。增加x,合金的显微硬度可以得到提高,但是耐腐蚀性下降;此外,极化曲线的阳极电流峰密度随着x的增加而下降,这些结果与固溶度以及Ag、Ni、Zn合金元素在含Cl-离子溶液中的溶解密切相关。

关 键 词：gold alloy thermal expansion MICROHARDNESS corrosion resistance 

分 类 号：TG146.31[一般工业技术—材料科学与工程]