低活化铁素体/马氏体CLF-1钢扩散连接接头组织及性能研究  

Research on microstructure and mechanical properties of diffusion bonding interface for reduced activation ferritic/martensitic CLF-1 steel

作　　者：王泽明[1] 任来超 何祖娟[1] 俞德怀[1] 单会祥 王世忠[1] 

机构地区：[1]中国核动力研究设计院,四川成都610041 [2]北京智创联合科技股份有限公司,北京101300

出　　处：《焊接技术》2016年第11期6-9,97,共4页Welding Technology

摘　　要：采用真空扩散连接工艺,通过优化焊接工艺参数及中间层元素,对低活化铁素体/马氏体CLF-1钢进行扩散连接。利用光学显微镜和SEM观察接头扩散界面的显微组织,EDX对整个扩散界面不同区域进行化学成分分析,万能拉伸试验机和落锤冲击试验机测定扩散界面的力学性能。结果表明:采用真空扩散连接方法可实现CLF-1钢的可靠连接,扩散界面拉伸性能与母材相当,冲击性能有待进一步提高。The diffusion bonding welding of reduced activation ferritic / martensitic CLF-1 steel was performed by optimizing welding parameters and intermediate layer elements with vacuum diffusion bonding process. Microstructure of diffusion bonding interface was observed by optical microscope. Chemical composition of different area on the whole interface was analyzed by EDX. Mechanical properties were tested by universal testing machine and drop hammer impact test machine. The results showed that the reliable bonding of CLF-1 steel could realize by the vacuum diffusion bonding method. The tensile strength of diffusion bonding interface was substantially the same with CLF-1steel, but the impact property needed to be improved.

关 键 词：CLF-1钢 扩散连接 显微组织 力学性能 

分 类 号：TG457[金属学及工艺—焊接]