PEK-C增韧环氧树脂的研究Ⅱ  

A Study on the Epoxy Adhesive Modified with Poly(Aryl Ether Ketone)Ⅱ

作　　者：冯浩[1] 曲春艳[2] 王德志[2] 毛勇[2] 王海民[2] 王文博[1] 王东旭[1] 

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040 [2]黑龙江省科学院高技术研究院,黑龙江哈尔滨150020

出　　处：《化学与粘合》2016年第6期427-429,436,共4页Chemistry and Adhesion

基　　金：黑龙江省科学院青年创新基金重点项目

摘　　要：采用酚酞基聚芳醚酮为增韧剂改性环氧树脂,以芳香胺为固化剂,制备出一种改性环氧树脂。研究了改性树脂的耐热性和微观结构。实验结果表明:随着酚酞基聚芳醚酮用量的增加,改性树脂的玻璃化转变温度先增高后降低,当酚酞基聚芳醚酮用量为15phr时,改性树脂的玻璃化转变温度最高,达到193℃。同时,改性树脂的微观结构随着PEK-C用量增加而发生变化。由海岛结构先转变成双连续互锁结构,最终发生相反转。A modified epoxy was prepared. The epoxy was modified by poly ether ketone-cadro （PEK-C） as toughener and aromatic amine as curing agent. The heat resistance and microstructure of the modified resin were studied. The result showed that the glass transition temperature of the modified resin increased firstly and then decreased with the increase of the dosage of PEK-C. When the PEK-C content was 15phr, the glass transition temperature was 193℃ which was the highest. And the microstructure of the modified resin would change with the increase of the amount of PEK-C. The phase structure converted from sea-island structure to double continuous interlocking structure, and finally the phase inversion occurred.

关 键 词：酚酞基聚芳醚酮 环氧树脂 增韧 耐热性 相态 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]