通孔器件引脚与过孔间距对焊点透锡的影响分析  

Analysis of The Influence of The Distance Between The Plated Through-Hole and The Pin to The Solder Penetration

作　　者：李佳宾[1] 白邈[1] 杨京伟[1] 杨志[1] 

机构地区：[1]北京空间机电研究所,北京100094

出　　处：《航天制造技术》2016年第5期41-43,共3页Aerospace Manufacturing Technology

摘　　要：对通孔元器件焊点焊料在焊盘孔内的毛细现象进行了理论分析,将不同引脚直径的电感线圈焊接至孔径为1mm连接大面积覆铜层的通孔焊盘,通过显微剖切试验观察其焊点的透锡效果,分析得出焊盘孔与器件引脚之间间隙对多层大面积覆铜层印制板通孔元器件焊点的透锡影响。In this paper, the capillary phenomenon of liquid solder in the plated through-hole is theoretically analyzed. The copper wires of different was welded diameter to the plated through-hole with the same diameter of lmm which is connected with a large area of copper layer. The penetration effect of solder joints was observed by micro dissection test. Finally, the paper analyzed the influences of the distance between the plated through-hole and the pin to the solder penetration of through hole components which connected with multilayer printed board＇s large area of copper layer.

关 键 词：大面积覆铜层 透锡 通孔元器件 间隙 

分 类 号：TN405[电子电信—微电子学与固体电子学]