微滴喷射打印银导线基础研究  

Basic research of printing silver conductive lines by droplet ejection

作　　者：肖渊[1] 蒋龙[1] 陈兰[1] 罗俊[2] 

机构地区：[1]西安工程大学机电工程学院,西安710048 [2]西北工业大学机电学院,西安710072

出　　处：《功能材料》2016年第11期11231-11236,共6页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(51475350);西安工程大学博士启动基金资助项目(BS1304)

摘　　要：针对当前丝网印刷、喷墨打印技术制备柔性导电线路过程中导线宽度受限、墨水制备难度大、成本高等问题,提出微滴喷射与化学沉积技术相结合成形导电线路的方法。利用构建的双喷头气动式微滴喷射系统,以浓度为1.96mol/L的硝酸银和1.31mol/L的抗坏血酸溶液进行按需喷射实验研究;在此基础上,以A4复印纸为基板进行不同沉积序列银导线成形试验,并对沉积成形银导线的方阻进行测量及微观形貌分析。结果表明,利用高速摄像机,获得了两种材料微滴成形的完整动态过程及形态变化;方阻测量结果表明,随着沉积序列次数的增加,银导线方阻的平均值由2.659Ω/□降低到0.045Ω/□,方阻的标准偏差由2.563Ω/□减小到0.022Ω/□;不同沉积序列次数成形导线SEM照片显示,随着沉积序列的增加,银导线内部孔洞减少,银微粒数量增加。In view of the problems of limited wire width,and great difficulty and high cost of ink preparation existing in the process of preparation of flexible conductive lines by current screen printing and inkjet printing technology,a method based on droplet ejection technology combined with chemical deposition for forming conductive lines is proposed.Using built double nozzle pneumatic droplet ejection device,on-demand jet experiment is carried out with a concentration of 1.96mol/L of silver nitrate and 1.31mol/L of ascorbic acid solution.On this basis,experiment of forming silver lines with different sedimentary sequence in A4 copy paper is conducted,and square resistance measurement and microstructure research of formed silver conductive lines with different sedimentary sequence are conducted.Results show that a complete dynamic process and morphology change of droplets forming of two materials are obtained by using high-speed cameras.Results of square resistance measurement show that with the increase in sedimentary sequence,the mean square resistance of silver conductive lines decreases from 2.659 to 0.045Ω/□,the standard deviation of square resistance decreases from-2.563 to 0.022Ω/□.SEM pictures of conductive lines with different sedimentary sequence show that with the increase in sedimentary sequence,the hole inside silver conductive lines reduces,the number of particles of silver increases.

关 键 词：按需喷射 微滴 沉积成形 银导线 

分 类 号：TH16[机械工程—机械制造及自动化]