基于HTCC的小型化下变频电路设计  

Design of a Miniaturized Down-Conversion Circuit Based on HTCC

作　　者：莫骊[1] 花婷婷[1] 闫超[1] 

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230088

出　　处：《雷达科学与技术》2016年第6期670-674,共5页Radar Science and Technology

摘　　要：下变频是超外差式接收机的核心电路之一。采用基于高温共烧陶瓷(HTCC)的微波多芯片模块(MMCM)的方式来设计下变频电路,可以实现电路的高度集成化和小型化。该电路在优化变频方案的前提下,内部布局合理,并且通过HFSS和ANSYS等多种仿真软件对电路的垂直转换进行优化,对二级安装后的热应力进行仿真,使各项指标均满足系统要求,并且使电路的可靠性和可制造性得到大幅度提高,可以满足在日渐有限的载荷、空间、功耗条件下实现高集成、小型化、低功耗多通道下变频电路的设计要求。Down-conversion circuit is one of the key circuits of superheterodyne receiver. To achieve high integration and miniaturization, the proposed down-conversion circuit is designed by microwave multichip module （MMCM） based on high-temperature co-fired ceramic （HTCC） technology. By optimizing the frequency conversion scheme, the layout of the down-conversion circuit is rational. Then HFSS and ANSYS are utilized to simulate and optimize the circuit＇s vertical transition and thermal stress. All simulation results meet the system＇s demands. Thus the reliability and manufacturability of the circuit are greatly improved, which meets the design requirements of high integration, miniaturization and low power consumption for multi-channel down-conversion circuits under the conditions of increasingly limited load, space, and power consumption.

关 键 词：下变频 高温共烧陶瓷 微波多芯片模块 小型化 

分 类 号：TN957.5[电子电信—信号与信息处理] TN85[电子电信—信息与通信工程]