铁鳞还原铁粉表面置换镀铜的添加剂优化  

Optimization of Additives for Replacement Copper Plating on Iron Powder Reduced from Mill Scale

作　　者：王勇[1] 刘月[1] 周飞飞[1] 谢帅[1] 

机构地区：[1]重庆大学材料科学与工程学院,重庆400044

出　　处：《材料保护》2016年第11期56-60,共5页Materials Protection

摘　　要：采用铁鳞还原铁粉制备铜包铁复合粉末时,添加剂的配方对复合粉末综合性能影响较大。在铁鳞还原铁粉表面化学镀铜制备复合粉末,通过正交试验研究了添加剂对铁鳞还原铁粉表面置换镀铜包覆层综合性能的影响;采用扫描电镜(SEM)和能谱仪(EDS)等对铜包覆层的表面形貌和断面形貌以及成分进行表征,用X射线衍射仪(XRD)检测包覆粉末的物相结构,并利用红外光谱仪(FT-IR)测试其表面的添加剂残留情况;分析了各类添加剂对包覆层质量的影响规律,得到的最优添加剂配方为0.160 0 g/L乙二胺四乙酸二钠(EDTA·2Na),0.001 0g/L 2-巯基苯并咪唑(M),0.003 5 g/L乙烯硫脲(N),0.450 0 g/L聚乙二醇(PEG),0.120 0 g/L十二烷基苯磺酸钠(SDBS)。最优添加剂配方条件下制备的复合粉末的铜包覆层均匀、连续、包覆效果良好,只含有铁和铜两相,包覆层中仅有微量添加剂成分残留。Cu-coated iron powders were fabricated by chemical replacement plating.The influence of additives on this process was investigated by orthogonal optimization experiment.Surface morphology,section morphology and element contents of the copper layer were analyzed using scanning electron microscopy(SEM)equipped with energy dispersive spectroscopy(EDS).The phase structure of the composite powder was determined by an X-ray diffractometer(XRD),and the residual additives in the powder were evaluated with an infrared spectrometer(FTIR).The effects of various factors on the quality of the coating layer were analyzed.Results showed that the optimum additive formulation was obtained,in which the contents of disodium ethylene diamine tetraacetate,2-mercaptobenzidazole,ethylene thiourea,polyethylene glycol and sodium dodecyl benzene sulfonate were 0.160 0g/L,0.001 0 g/L,0.003 5 g/L,0.450 0 g/L and 0.120 0 g/L,respectively.Under the optimized conditions,the Cu coating on the composite powders was uniform and continuous,and the cladding effect was good.Fe and Cu were only contained and in the cladding layer only existed trace additives.

关 键 词：铁鳞还原铁粉 置换镀铜 铜包铁粉 正交试验 添加剂 

分 类 号：TF123.74[冶金工程—粉末冶金]