无机填料对环氧/聚酰胺固化体系热膨胀行为的影响研究  

Influence of inorganic fillers on thermal expansion behavior of epoxy/polyamide curing system

作　　者：陈泽明[1,2] 曹先启[1] 李博弘[1] 朱龙基[1] 王超[1,2] 李卫东[3] 白永平[3,4] 

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040 [2]黑龙江省科学院高技术研究院,黑龙江哈尔滨150020 [3]哈尔滨工业大学无锡新材料研究院,江苏无锡214100 [4]哈尔滨工业大学化工与化学学院,黑龙江哈尔滨150001

出　　处：《粘接》2016年第12期28-30,35,共4页Adhesion

摘　　要：分别研究3种无机填料氧化铝（Al2O3）、氮化硼（BN）和二氧化硅（SiO2）以及这3种填料经表面处理后对环氧树脂／200#聚酰胺体系热膨胀行为的影响。研究表明，表面处理后的无机填料能在树脂基体中分布均匀，其固化体系的热膨胀行为变化比较均匀且有规律。In this paper, the influence of inorganic fillers, including A1203, BN and SiO2, and surface treatment of the fillers on the thermal expanding behavior of the epoxy resin/200# polyamide resin curing system was studied. It was found that the surface-treated fillers were more uniformly distributed in the curing system, and the change of expanding behavior of the curing system containing the surface-treated fillers was more even and regular.

关 键 词：无机填料 环氧树脂 热膨胀行为 

分 类 号：TQ433.437[化学工程]