热循环对铜包铝母排显微组织与力学性能的影响  

Thermal cycle effects on microstructures and mechanical properties of copper-clad aluminium bus bars

作　　者：王冰[1] 刘平[1] 刘新宽[1] 王子延 陈小红[1] 刘小稚 

机构地区：[1]上海理工大学材料科学与工程学院,上海200093 [2]亚仕龙汽车科技(上海)有限公司,上海200433

出　　处：《功能材料》2016年第12期12104-12109,共6页Journal of Functional Materials

基　　金：国家自然科学基金资助项目(51201107)

摘　　要：在自主开发的热循环试验机上对铸轧法生产的铜包铝母排进行了热循环试验。为了研究不同热循环温度与热循环次数对结合界面显微组织与力学性能的影响,在200,250和300℃的热循环温度下分别完成了2 000,600和100次的热循环试验。采用ZWICK-Z050电子万能材料试验机测试界面结合强度,用扫描电子显微镜（SEM）和偏光显微镜（PM）观察界面形貌,用电子探针（EPMA）和X射线衍射仪（XRD）进行物相分析。结果表明,热循环温度为200℃时,随着循环次数的增加,界面结合强度先增大后减小,界面结合层宽度先减小后增大;热循环温度为250或300℃时,随着循环次数的增加,界面结合强度显著减小,界面结合层宽度明显增大;界面结合层宽度越大,结合强度越低;界面中间化合物主要为Al2Cu、Cu9Al4和CuAl,其中铜侧主要是Cu9Al4和CuAl相,铝侧主要是Al2Cu相;200-300℃范围内的热循环并未引起中间化合物质或量的改变。The thermal cycle tests were conducted on copper-clad aluminium bus bars which were produced by the roll casting method with an independently developed device.To explore the effects of different thermal cycle temperatures and times on microstructures and mechanical properties of the interface,thermal cycle tests of 2000 cycles,600 cycles and 100 cycles were performed at 200,250 and 300 ℃ respectively.The bond strength was tested on electronic universal test machine ZWICK-Z050,the microstructures of interfaces were observed by scanning electron microscope （SEM）and polarizing microscope （PM）,and the phases were determined by e-lectro-probe microanalyzer （EPMA）and X-ray diffraction （XRD）.The results indicated that at 200 ℃,the bond strength increased firstly and decreased lately while the width of the interface bonding layer decreased first and then increased with cycle times increasing.At 250 ℃ or 300 ℃,the bond strength decreased apparently and the width of the interface bonding layer increased obviously.The wider the bonding layer,the lower the bond strength.The intermediate compounds at the interface were mainly Al2 Cu,Cu9 Al4 and CuAl.Cu9 Al4 and CuAl phases were mainly on Cu side,and Al2 Cu phase was chiefly on Al side.Besides,the thermal cycle between 200 and 300 ℃ didn＇t change variety or quantity of the intermediate compounds.

关 键 词：铜包铝母排 热循环 结合层 结合强度 显微组织 金属间化合物 

分 类 号：TG405[金属学及工艺—焊接]