环氧树脂固化过程中的黏弹性分析  

Rheological monitoring of the reacting curable epoxy resin

作　　者：李润明[1] 田培[1] 石家华[1] 

机构地区：[1]河南大学化学化工学院,河南开封475004

出　　处：《化学研究》2016年第6期763-766,共4页Chemical Research

基　　金：河南省教育厅重点科研项目(14A430013)

摘　　要：环氧树脂在电子线路板、航空工业以及高性能运动器材行业有着广泛的应用,其成型工艺普遍采用反应注射浇铸成型技术,注射温度及时间、保温温度及时间对得到尺寸满意的制品具有重要意义.通过升温测试,获得了树脂黏度和动态模量对温度的演变关系;通过一系列不同温度的保温测试,获得了凝胶化时间对温度的关系.结果表明,可以通过黏弹性能有效示踪固化过程中的结构演变,从而为反应成型加工提供有效、有用的工艺参数.Epoxy resins form the matrix in filled plastics and fiber-reinforced composites used in a diversity of products.These range from consumer items and auto body panels to advanced composites for printed circuit boards（PCBs）,aerospace structural components,and high-performance sports equipment.As the curing reaction progresses,the two moduli cross at the gel point,beyond which the storage modulus becomes larger than the loss modulus and the material hardens.These techniques provide a greater understanding of traditionally complex thermoset processes and effective quality control measures for these processes,and will reduce design and operating costs in associated industries.

关 键 词：环氧树脂 固化 复数黏度 动态模量 

分 类 号：O631[理学—高分子化学]