催化剂添加量对部分化学亚胺化法制备聚酰亚胺薄膜的影响  

Effect of Catalyst Amount on Preparation of Polyimide Films by Partly Chemical Imidization

作　　者：冯婷婷[1] 汪英[1] 唐小青[1] 青双桂[1] 周福龙 黄孙息[1] 

机构地区：[1]桂林电器科学研究院有限公司,广西桂林541004

出　　处：《绝缘材料》2016年第12期37-40,共4页Insulating Materials

基　　金：桂林电器科学研究院有限公司创新基金项目(15632)

摘　　要：以均苯四甲酸二酐(PMDA)和4,4′-二氨基二苯醚(ODA)为单体,采用部分化学亚胺化法制备了聚酰亚胺薄膜,研究了催化剂添加量对聚酰亚胺薄膜性能的影响。结果表明:随着催化剂添加量的增加,酰亚胺化反应速率加快,相同时间内聚合物分子链中酰亚胺环的含量增加,使聚酰亚胺薄膜的聚集态结构有序性增加,力学性能明显提高。采用部分亚胺化法制得的PI薄膜具有良好的热稳定性,催化剂的添加量对其热稳定性影响不大。A polyimide （PI） film was prepared by partly chemical imidization method with pyromellitic dianhydride （PMDA） and 4,4＇-diaminodiphenyl oxide （ODA） as monomer. The effect of catalyst amount on the properties of the PI films was investigated. The results show that with the increase of catalyst amount, the reaction rate of imidization accelerates, and the imide ring contents in the polymer chain increase, which makes the ordering of aggregation structure and the mechanical properties of PI film increase. The PI film prepared by partly chemical imidization has good thermal stability, and the catalyst amount has little effect on its thermal stability.

关 键 词：聚酰亚胺 部分化学亚胺化 催化剂 薄膜 

分 类 号：TM215.3[一般工业技术—材料科学与工程] TQ323.7[电气工程—电工理论与新技术]