工艺辅料引起的PCB失效案例分析  

Failure Cases Analysis of PCB Caused by Process Accessories

作　　者：王新娟[1] 杨永兴[1] 

机构地区：[1]工业和信息化部电子第五研究所华东分所,江苏苏州215011

出　　处：《电子产品可靠性与环境试验》2016年第6期31-35,共5页Electronic Product Reliability and Environmental Testing

摘　　要：工艺辅料残留引起的腐蚀是PCB制程工艺中的常见问题。通过对工艺用料引起的PCB失效案例进行分析,发现工艺辅料残留主要是材料自身残留和制程操作不规范这两方面的因素引起的,掌握这些现象的机理,有利于相关工程技术人员规范操作过程、合理地选择材料,从而降低故障发生的风险。The corrosion caused by process accessories residue is a common problem in the PCB manufacturing process. Through the analysis of PCB failure cases caused by process accessories, it is found that the process accessories residue is mainly caused by material residue itself and the non-standard process operation. To grasp the mechanism of these phenomena is conducive to the relevant engineering and technical personnel to regulate the operation process and reasonably select materials, so as to reduce the risk of failure.

关 键 词：工艺辅料 残留 失效分析 失效机理 

分 类 号：TN41[电子电信—微电子学与固体电子学]