超疏水铜表面的电化学制备及其耐腐蚀性能  

Electrochemical Fabrication and Corrosion Resistance Performance of Superhydrophobic Copper Surface

作　　者：刘为凯[1] 李双芝[1] 曾小翠[1] 刘丽君[1] 

机构地区：[1]武汉纺织大学化学与化工学院,湖北武汉430073

出　　处：《武汉纺织大学学报》2016年第6期67-71,共5页Journal of Wuhan Textile University

摘　　要：通过用电沉积法在铜片表面上生长了具有双尺寸粗糙度的铜膜,并用扫描电镜(SEM)、X射线能量色散谱(EDX)、X射线衍射仪(XRD)、接触角测量仪以及电化学工作站等对其进行详细表征。结果表明,所得铜表面是由纳米片组成的微米花组成。经硬脂酸修饰后,所得铜表面具有优异的超疏水性、不粘附性和耐腐蚀性能;与水的表面接触角高达167°,滚动角低至1.8°。超疏水性能归因于铜片表面上的微纳米结构以及低表面能的硬脂酸分子。A Cu film with dual scale roughness was synthesized on Cu foil via an electrodeposition method. The resulting Cu foil was characterized by scanning electron microscopy （SEM）, energy disperive X-ray （EDX）, X-ray diffraction （XRD）, contact angle measurement and Tafel curves. The results show that the resulting Cu foil is covered by numerous Cu micro-flowers composed of nanoplates. After modification with stearic acid （STA）, the Cu foil shows a promising superhydrophobic, non-sticking and anticorrosive properties. The contact angle is measured to be 1671 and the sliding angle is as low as -1.81. The superhydrophobicity is ascribed to the unique micro-/nanostructures together with the low surface energy of STA.

关 键 词：铜 电沉积 超疏水 Tafel曲线 耐腐蚀 

分 类 号：O647.5[理学—物理化学]