RTM工艺用乙烯基酯树脂体系固化动力学  

Application in RTM of the vinyl ester resin curing kinetics

作　　者：赵晓琳[1] 杜建华[2] 高恒 范涛[1] 李辉[2] 王大峰[1] 吕莹莹[1] 贾成厂[1] Zhao Xiaolin Du Jianhua Gao Heng Fan Tao Li Hui Wang Dafeng Lv Yingying Jia chengchang(School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, China Department of Science Research, Academy of Armored Force Engineering, Beijing 100072, China Department of Self-propelled Gun, Nanjing Artillery Academy, Nanjing 211132, China)

机构地区：[1]北京科技大学材料科学与工程学院,北京100083 [2]装甲兵工程学院科研部,北京100072 [3]南京炮兵学院自行火炮系自行火炮教研室,南京211132

出　　处：《粉末冶金技术》2016年第5期336-340,共5页Powder Metallurgy Technology

基　　金：国家自然科学基金(51001117)

摘　　要：采用差示扫描量热法(DSC)对树脂传递模塑(Resin Transfer Molding,简称RTM)工艺应用双酚A型乙烯基酯树脂体系的固化工艺进行研究,分析不同升温速率对固化体系的DSC曲线的影响,并利用Kissinger方程、Crane经验方程等固化动力学方程,确定该固化体系的反应动力学方程t=1-[1-5 584.65exp(-4 352.90/T)t]6.67,采用温度-升温速率(T-β)外推法从理论上得到体系的凝胶温度、固化温度和后固化温度等固化工艺参数为61.66,74.55,95.49℃。在实际应用中,由于内部反应热存在,适当降低使用温度。固化动力学方程及固化工艺参数对树脂传递模塑(RTM)工艺有重要意义。The cure technology of bisphenol A type vinyl ester resin system applying to RTM was studied by differential scanning calorimetry（ DSC）. The curing reaction equation of the resin system was ascertained by Kissinger and Crane equations. The equation was t = 1- [1- 5 584. 65exp（- 4 352. 90 / T） t]6. 67. Gelling temperature,curing temperature and post-treating temperature were calculated by extrapolating Ttemperature-Heating rate（ T-β） curves and were 61. 66 ℃,74. 55 ℃,95. 49 ℃,respectively. In practice,due to internal heat of reaction,applicable temperature need to reduce. The curing reaction equation and cure parameters have great significance for Resin Transfer Molding（ RTM） process.

关 键 词：乙烯基酯树脂 DSC 固化动力学 

分 类 号：TQ323.5[化学工程—合成树脂塑料工业]