Ag基中温钎料及焊膏的研究进展  

Research Progress on Silver-based Medium Temperature Solder and Paste

作　　者：郑苗[1] 王晓蓉 范仲华 陈融 王天根[1] 刘薇[1] 

机构地区：[1]中国计量学院材料科学与工程学院,浙江杭州310018 [2]杭州华光焊接新材料股份有限公司,浙江杭州311112

出　　处：《铸造技术》2016年第12期2719-2723,共5页Foundry Technology

摘　　要：Ag基钎料具有良好的润湿性、耐腐蚀性、导电性、导热性和高强度等特点,使其成为应用广泛的钎焊材料。通常以银基钎料为基础添加合金或稀土元素来改善其性能,同时对钎料的制备工艺进行创新。随着焊料的发展,焊膏这种新型焊接材料取代传统钎料。综述了Ag基为主中温钎料的研究现状以及中温银基焊膏的研究进展,展望了银基中温钎料的发展方向。Ag-base solder was widely used in brazing due to the characteristics of their perfect wetability, excellent corrosion resistant, excellent electrical conductivity, excellent thermal conductivity, higher strength etc. Usually by adding alloy or rare earth elements into the Ag-base filler metals improve it＇s performance, and the innovative preparation process of solder was developed. With the development of the solder, the solder paste as a new type of welding material has replaced traditional solder. The research progress on Ag-based mid-temperature solder and paste were introduced and the future developments of mid-temperature solder were also given.

关 键 词：中温钎料 Ag基钎料 Ag基焊膏 

分 类 号：TG425[金属学及工艺—焊接]